Crystal Systems, Inc. Oct 26, 2009

Crystal Systems combines state-of-the-art sapphire material with advanced processes to meet the demands of today's commercial, optical and military markets.

• Listed products

CSI's efforts are marked by the distinction of being producers of the largest diameter sapphire crystals worldwide; only producers of sapphire that is free of light scatter; and largest and highest FOM Ti:sapphire for laser applications.

Crystal System's patented Heat Exchanger Method (HEM) for growth of large crystals sets the standard for crystal size and perfection. This unique process has led to new high-tech applications and advancements in technology for industry.

Crystal Systems has unveiled its patented technology for slicing crystals -- the Fixed Abrasive Slicing Technology (FAST). This announcement launches the worldwide commercialization of the technology that was developed at the company's headquarters in Salem, MA.

• FAST is a highly effective slicing process in which expensive materials are sliced using a multi-wire bladepack of wires with diamond particles fixed on them.

• FAST is ideally suited for multiple wire slicing of silicon, sapphire, silicon carbide and other expensive materials requiring precise fabrication.

• A key application for FAST has been its use for slicing sapphire wafers used in Light Emitting Diode (LED) technology. This allows CSI to slice material closer to net shape in 1/3 the time of multi wire slurries with less damage to the crystal.

Check out our on-line catalogue for a comprehensive list of products available.

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Keywords include:
Crystals, Sapphire, Ti:sapphire, Silicon, Domes Dental Brackets, Endoscopes Grocery Scanners, Submarine telescope windows, optics, optical, laser, solar, HEM, FAST, substrate.