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About this event

Web site…
23 Oct 2013
Teddington, London, Middlesex, United Kingdom
National Physical Laboratory
Contact address
United Kingdom


Failure Analysis for Electronic Assembly - How to Do It

This workshop will outline the techniques that should be considered, along with practical case studies, from the instructor's many years' experience in manufacture. Practical case studies using different techniques to examine failures on different interconnections will be examined, with extensive examples and recommended corrective action. Delegates will also be able to see different analysis techniques and find what a laboratory service will require when you need to arrange your own study.

The workshop will be conducted by Bob Willis and members of the NPL EI team, who offer failure analysis services to the industry and have long been regarded as one of the leading specialists in mechanical and analytical assessment.

Workshop topics will include:

Printed circuit boards
Solder joints
Conventional components
SMT components
Area array, BGA, Flip Chip devices
Wire wrap joint
Crimp terminals

Destructive and non-destructive analysis techniques will be reviewed, including:

Optical microscopy
Real time X-ray analysis
Scanning Electron Microscopy (SEM)
Acoustic microscopy
XRF Measurement
Chemical Analysis
Crack detection
Contamination assessment
Bond and shear measurement
Solderability measurement
Who should attend:

The workshop is designed for engineers, supervisor and quality engineering staff who need to solve manufacturing and product failures. It is also ideal for procurement staff who may be a faced with supplier related failures.

Registration and coffee will take place from 09:00 hrs, with the workshop formally starting at 09:30 hrs.

The cost to attend is £150 + VAT
**To register please click the hyperlink