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Advanced Thermal Adhesive Film Assures Reliable Electronic Component Operation Oct 1, 2009

Master Bond’s FL901AO thermal adhesive film serves as a heat-transfer path between heat-generating components and heat sinks or other cooling devices.

Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100% solid, B-stage adhesive-preform provides a high bond strength, no-mess solution to electronic assembly and other industrial bonding and sealing operations. An attractive characteristic of the FL901AO epoxy preform is its ability to cure quickly at quite moderate temperatures. While FL901AO exhibits a thermal conductivity on a level of 10 BTU•in/ft²hr°F, it is highly electrically insulating, with volume resistivity exceeding 10x1012 ohm-cm.

Read more about Master Bond’s Epoxy Films and Preforms: http://www.masterbond.com/prodtype.html#pfilm

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